Research Output
Aminoacetic acid as complexing agent in baths for electroless deposition of Ni–W–P coatings
  Ni–W–P alloy coatings were deposited from a bath containing, nickel sulphate (VI), sodium tungstate (VI), sodium hypophosphite, sodium formate, and a complexing agent. The complexing agents were formic acid, acetic acid, lactic acid, succinic acid, malic acid, malonic acid, aminoacetic acid and triethanoloamine. It is shown that Ni–W–P coatings are deposited the slowest when complexing agents with the highest stability constants are used. As the deposition rate increases, i.e. in the presence of less stable complexing compounds, the amount of tungsten in the coating decreases. When aminoacetic acid and citric acid were used, the tungsten content in the coating amounted to ∼2 wt-%, depending on the complexing agent concentration and the pH of the bath.

  • Type:

    Article

  • Date:

    31 October 2006

  • Publication Status:

    Published

  • Publisher

    Informa UK Limited

  • DOI:

    10.1179/174591906x149464

  • Cross Ref:

    10.1179/174591906X149464

  • ISSN:

    0020-2967

  • Library of Congress:

    TK Electrical engineering. Electronics Nuclear engineering

  • Dewey Decimal Classification:

    621.3 Electrical & electronic engineering

Citation

Szczygieł, B. & Turkiewicz, A. (2006). Aminoacetic acid as complexing agent in baths for electroless deposition of Ni–W–P coatings. Transactions of the Institute of Metal Finishing. 84(6), 309-312. doi:10.1179/174591906x149464. ISSN 0020-2967

Authors

Keywords

Mechanics of Materials; Surfaces, Coatings and Films; Surfaces and Interfaces; Condensed Matter Physics; Metals and Alloys

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