Article
12 April 2012
Published
American Chemical Society
10.1021/ie202625n
0888-5885
TK Electrical engineering. Electronics Nuclear engineering
621.3 Electrical & electronic engineering
Nwosu, N., Davidson, A., Hindle, C., & Barker, M. (2012). On the Influence of Surfactant Incorporation during Electroless Nickel Plating. Industrial & engineering chemistry research, 51(16), 5635-5644. https://doi.org/10.1021/ie202625n
School of Engineering and The Built Environment
LecturerSchool of Engineering and The Built Environment
0131 455 2622
c.hindle@napier.ac.uk
electroless nickel plating(ENP); surfactants; coating characteristics;